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reflow profile optimized to extra paste issuein charging ic in HMD vibe
The existing reflow oven profile is based on an old part which has copper tinning not optimized for the latest silver tinning part which caused the extra paste after the reflow due to which 0.50% rejection in smt for same
Now after the soak time changed from the 55 sec to 68 sec the issue got resolved and rejection decreased to 0.05%
14-01-2026
27-01-2026
Productivity
HOD okby : Sachin Rana
KPO: okby :
CI: okby : Shubham Srivastava
