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We resolved BGA IC part shifting by moving the part to mounter 6, using a special 185N nozzle with a rubber tip, and adding Pre AOI detection. This improved part stability and alignment.
we are facing BGA IC Part shifting issue due to Vacuum leakage with normal nozzle due to part pick up surface is metallic. First time we are using this type of component in 5G.
Now Part moved from mounter 7 to 6 and add Special Nozzle 185N with rubber tip to stable pickup position and also given detection at Pre AOI as well as validation the result found improved.
03-12-2025
08-12-2025
Productivity
HOD Okby : Raju Kumar Chaurasiya
KPO: Approvedby : Jyoti Prasad Mallick
CI: OKby : Shubham Srivastava
