| Kaizen Description |
Shorting failure was observed during solder paste printing and reflow due to excessive paste deposition and stencil design mismatch. By optimizing the stencil aperture size and shape, paste release and solder volume were controlled, resulting in improved print quality and reduced shorting defects. |
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| Before Situation |
Frequent shorting failures observed on fine-pitch components (e.g. CPU, PMIC).
Shorting rate: 0.8% of total boards (~80 PPM).
SPI showing volume >130% on critical pads.
Existing stencil: thickness 0.12 mm, aperture 1:1 ratio (no reduction).
Rework and inspection time were high, affecting line productivity. |
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