In the feature phone SMT printer, the stencil underside cleaning paper width was reduced from 20 mm to 8 mm after trial verification. The purpose was to minimize paper wastage, reduce downtime due to frequent roll changes, and lower material cost while maintaining the same cleaning performance and print quality.

• Cleaning paper width optimized to 8 mm after successful cleaning efficiency trial. • Cleaning performance and print quality verified – no change in result. • Paper consumption reduced by approximately 30%. • Replacement frequency reduced by 30%. • Change implemented and standardized across all feature phone printer lines.

18-10-2025