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Changed in the process of the Pcba fixing.
High failure of hang and camera fail in Moto A300 (0.33%) in which pcba bend during fixing in B shell.
Change in the process of pcba fxiing in the B shell.Before the operator press the pcba while fixing fron the same area where Cpu is mounted , Now the process changed of fixing by which the pcba from the other side .rej reduced to 0.05%
01-09-2025
04-09-2025
Quality
HOD okby : Rohit dwivedi
KPO: okby :
CI: okby : Shubham Srivastava