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Kaizen

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Plan

Initiator

HOD ok
by : Rohit dwivedi

KPO: ok
by :

CI: OK
by : Shubham Srivastava

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description	During SMT process, frequent shorting failures were observed after solder paste printing. This was leading to high defect rate and rework load. Shorting was mainly caused due to solder paste smearing and clogging in stencil apertures. Improper paste release resulted in bridging between pads.
Before Situation	High frequency of shorting failures observed during SMT assembly after solder paste printing. Solder bridging occurred mainly on fine-pitch components. Increased rework & repair activities, leading to extra manpower and time consumption. Stencil apertures often got clogged, but no fixed cleaning frequency was followed. Overall First Pass Yield (FPY) was low, and process stability was poor.
After Situation	Stencil cleaning frequency improved from once every 8 hours to once every 4 hours. Proper cleaning method implemented (vacuum + dry + wet wipe). Shorting failures reduced significantly, especially on fine-pitch components. First Pass Yield (FPY) improved and rework reduced. Process became more stable and consistent with fewer line stoppages.
Kaizen Start Date	13-08-2025
Kaizen End Date	24-08-2025
Result	Quality
Cost Calculation Sheet
Improvement Details