| Before Situation |
Earlier, in the cooling zone of the Reflow oven, we used a chiller-based cooling system to cool the PCB. This resulted in inconsistent temperature control and frequent moisture issues.
Problem / Issue Identified:
Uneven cooling was observed with the chiller system.
Condensation formed on PCBs, affecting solder joints. |
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| After Situation |
Now, instead of the chiller, we use Nitrogen gas to cool the PCB. Nitrogen is a dry and inert gas, which:
Prevents oxidation of solder joints
Ensures controlled and uniform cooling
Eliminates moisture-related defects |
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