Kaizen

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HOD ok
by : Jai Prakash Singh

KPO: ok
by : Jai Prakash Singh

CI: ok
by : Shubham Srivastava

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description

Earlier we did underfill glue in the smartphone and found a lot of issues related to spread glue at many locations so failure increased at assembly.

Before Situation

Earlier we did underfill glue in the smartphone and found a lot of issues related to spread glue at many locations so failure increased at assembly.

After Situation

Now we remove underfill glue permanently in all smartphones. Now problem has solved .

Kaizen Start Date

30-05-2025

Kaizen End Date

31-05-2025

Result

Quality

Cost Calculation Sheet
Improvement Details