Kaizen

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HOD ok
by : Jai Prakash Singh

KPO: ok
by : Jai Prakash Singh

CI: ok
by : Shubham Srivastava

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description

Earlier we did underfill glue in the smartphone and found a lot of issues related to spread glue at many locations so failure increased at assembly.

Before Situation

Earlier we did underfill glue in the smartphone and found a lot of issues related to spread glue at many locations so failure increased at assembly.

After Situation

Now we remove underfill glue permanently in all smartphones. For doing this problem has resolve .

Kaizen Start Date

22-04-2025

Kaizen End Date

23-04-2025

Result

Quality

Cost Calculation Sheet
Improvement Details