We improved the process by introducing a jig to prevent excess solder paste from accumulating on the PCBA conductive cloth pad area during LCD soldering.

To avoid this issue, the Kapton tape option was replaced with a jig. Benefits: Two extra manpower requirements removed. Kapton tape consumption cost eliminated. Following the implementation of the jig, the issue was identified during process validation and has been permanently resolved through corrective action.

02-04-2025