Due to copper foil miss alignment which is shorting the receiver pad. As per analysis and regeneration of defect , we have observed crack/low issue generate after a certain time after the device is turned on due to this defect not captured in FT during sequential Check.

A visual inspection operator deployed on line after this stage so that no such issue of foil misalignment gets bypassed from the stage. Clear Instructions defined in SOP of the copper foil pasting stage to check & match the alignment of the copper foil. SSI Checkpoint provided in PCBA fitment stage so that the operator after fitment checks the alignment of copper foil and ensure that the foil is not touching the receiver pad.

20-03-2025