Kaizen Corner

Kaizen

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Plan

Initiator

HOD ok
by : Sachin Rana

KPO: ok
by : Rajiv Kumar

CI: OK
by :

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description
Before Situation	P Sensor Dry soldering due less solder in the pad, paste at the PCBA pad not getting melt properly and making contact with the part
After Situation	Now we have increased 3 mils in both length & width of stencil aperture by this issue has been eliminated.
Kaizen Start Date	28-01-2025
Kaizen End Date	28-01-2025
Result	Productivity
Cost Calculation Sheet
Improvement Details