Kaizen

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HOD ok
by : Jai Prakash Singh

KPO: ok
by : Jai Prakash Singh

CI: ok
by : Abhishek Chauhan

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description

P Sensor Dry soldering due less solder in the pad, paste at the pcba pad not getting melt properly and making contact with the part.

Before Situation

P Sensor Dry soldering due less solder in the pad, paste at the pcba pad not getting melt properly and making contact with the part.

After Situation

Now we have increased 3 mils in both length & width of stencil aperture by this issue Has been eliminated.

Kaizen Start Date

14-01-2025

Kaizen End Date

15-01-2025

Result

Quality

Cost Calculation Sheet
Improvement Details