Kaizen
Back
excess solder ball at USB pin in model -YUVA 2 5G sub found at VI stage.
we found excess solder at USB pin hole in top side at printer stage. which get further create excess height at VI stage.
for this we adjust the printer printing parameter to reduce the amount of solder paste at USB pin hole location. printing force (9 to 5 kg) printing speed (70m to 130 mm/s) printing gap (-2 to -0.5)
25-12-2024
28-12-2024
Productivity
HOD Approvedby : Ankur Sharma
KPO: Approvedby : Jyoti Prasad Mallick
CI: okby :