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Blaze 3 5G model facing bridging issue
Previously we are facing bridging issue in U2715.After reflow we are getting bridging issue due to ground pad opening.
Now after modify the stencil we change the opening of stencil at ground pad so paste transfer efficiency is less as compared to previous modification.
04-11-2024
13-11-2024
Quality
HOD Okby : Ankur Sharma
KPO: Approvedby : Jyoti Prasad Mallick
CI: okby :