Kaizen
Back
stencil modification for p sesnor dry issue in smart phone model- blaze X
P Sensor Dry soldering due less solder in the pad, paste at the pcba pad not getting melt properly and making contact with the part
noe we have increased 3 mils in both length & width of stencil aperture by this issue ahs been eliminated
22-10-2024
23-10-2024
Productivity
HOD okby : Sachin Rana
KPO: okby : Rajiv Kumar
CI: okby :
