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stencil modification for p sesnor dry issue in smart phone model- blaze X
P Sensor Dry soldering due less solder in the pad, paste at the pcba pad not getting melt properly and making contact with the part
noe we have increased 3 mils in both length & width of stencil aperture by this issue ahs been eliminated
18-09-2024
19-09-2024
Quality
HOD okby : Sachin Rana
KPO: okby : Rajiv Kumar
CI: okby :
