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HOD ok
by : Rohit dwivedi

KPO: Approved
by : Jyoti Prasad Mallick

CI: ok
by : Aman sharma

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description

stencil modification for p sesnor dry issue in smart phone model- blaze X

Before Situation

P Sensor Dry soldering due less solder in the pad, paste at the pcba pad not getting melt properly and making contact with the part

After Situation

noe we have increased 3 mils in both length & width of stencil aperture by this issue ahs been eliminated

Kaizen Start Date

20-09-2024

Kaizen End Date

24-09-2024

Result

Quality

Cost Calculation Sheet
Improvement Details