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We are facing High failure of dry soldering in BLAZE X main Board .
We are facing High failure of dry Soldering issue in Model BLAZE X main board because of less solder at BGA location due to same productivity reduced and also RTY going down.
Now We modify Stencil opening from 8.2 Mil to 8.5 Mil and also stencil opening of BGA is 100% at BGA location to achieve high volume and reduce dry soldering. So now we reduce dry soldering issue and improve productivity and RTY DATA.
15-08-2024
30-08-2024
Productivity
HOD Approvedby : Ankur Sharma
KPO: Approvedby : Jyoti Prasad Mallick
CI: okby :
