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Reduce Dry soldering failure to modified the stencil.
Earlier we were facing high failure related to Dry soldering at location CPU (U400),In model - Blaze X MB.
Now we have modified the stencil at the CPU location for increase the Solder to reduce the Dry soldering failure. Model -Blaze X MB
16-07-2024
19-07-2024
Quality
HOD okby : Rohit dwivedi
KPO: Approvedby : Jyoti Prasad Mallick
CI: okby :