| Before Situation |
During production found keypad pip damage on line.
After analysis at supplier end found during the Mass production time of keypad in forming process, some silicon get stuck inside the mold cavity. Due to this extra silicon inside the cavity, there was no space left inside cavity to form the desire shape of keypad
Before time supplier was only doing cleaning of mould after every break with cleaner. To avoid the foreign or unwanted particles from the mould’s cavity. |
 |
|
