Kaizen

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HOD ok
by : Hemant kumar

KPO: ok
by :

CI: good
by :

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description

Earlier we did underfill glue in the smartphone and found a lot of issues related to spread glue at many locations so failure increased at assembly. Now we remove underfill glue permanently in all smartphones.

Before Situation

Earlier we did underfill glue in the smartphone and found a lot of issues related to spread glue at many locations so failure increased at assembly.

After Situation

Now we remove underfill glue permanently in all smartphones.

Kaizen Start Date

08-05-2024

Kaizen End Date

15-05-2024

Result

Quality

Cost Calculation Sheet
Improvement Details