Kaizen
Back
Before-Previously we are facing solder ball and sim connector uplift issue due to pallet not open on sim card through-hole location.
After-Now we modify the pallet in house on sim connector through-hole location so temp. properly reached at sim connector so uplift issue and solder ball issue resolved. last One month continue observed but we can not face such issue repeatedly.
23-04-2024
24-04-2024
Productivity
HOD okby : Sunil kumar
KPO: okby : Jai Prakash Singh
CI: okby :
