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BGA part shifting & skew issue.
Before we are facing BGA IC Part shifting issue due to Vacuum leakage with normal nozzle due to part pick up surface is metallic. First time we are using this type of component in 5G.
After Part moved from mounter 7 to 6 and add Special Nozzle 185N with rubber tip to stable pickup position and also given detection at Pre AOI as well as validation the result found improved.
05-04-2024
11-04-2024
Productivity
HOD Okby : Ankur Sharma
KPO: Approvedby : Jyoti Prasad Mallick
CI: okby :
