Kaizen
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IN SMARTPHONE WE HAVE FOUND HIGH SCRAPAGE DURING REPAIR DUE TO HIGH AMOUNT GLUE IN BGA DURING REPAIR BGA BALL REMOVE SO SCRAP.
EARLIER WE HAVE DONE 0.030 mg TO 0.050mg glue due to this high amount during pcb repair bga pad off in smart phone
now we have done 0.025 mg to 0.030 mg after that scrap rate during repair will be reduce .
12-06-2023
15-06-2023
Quality
HOD okby : Rohit dwivedi
KPO: approvedby :
CI: okby :
