| Before Situation |
"We are facing A1 2021 PCB pad ( LCD MIC SPK VIB ) soldiring issue due to oxidation because Exclusion of gold and nickel thickness caused by poor welding and As for the gold on the film, it is caused by the high copper ion in the micro-etching cylinder during OSP processing. It is required that copper ion ≦15g/L, and the actual analysis result is 14.85g/L, which has reached the end of cylinder change.
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| After Situation |
After improvement no issue observed, we have made improvement at supplier end,1. During shipment inspection, once gold abnormality on film is found in the product, in addition to verifying weldability test, contact the client for this abnormality according to the actual situation to obtain approval from the client. Before the approval of the customer, it shall be controlled according to the following and copper ion range reduced ≦13g/L |
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