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HOD OK
by : Hemant kumar

KPO: Ok
by :

CI: OK
by :

Team Member - 1
Team Member - 2
HOD
KPO
CI Team
Finance
Kaizen Theme
Kaizen Description

In lava blaze sub pcba glue on antenna pin issue high.

Before Situation

In model lava blaze sub pcba earlier during gluing/curing process, we are facing glue issue on antenna pin due to sub pcba tray is not in separate form.so during movement pcba touched together and glue comes on antenna.

After Situation

Now we have doing glue and curing in pcba in panel form and use reflow oven for curing. Also following single pieces flow so with the help of this glue issue reduced.

Kaizen Start Date

04-07-2022

Kaizen End Date

21-07-2022

Result

Quality

Cost Calculation Sheet
Improvement Details