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some process change for glue paste on sub pcba...
2- After gluing we keep SUB PCBA in ESD oven tray and during movement PCBA touched together due to this issue occur. (Glue pcba create failure in assy line for rf) image attached.
Now we have made process that gluing and curing both will done at same stage near reflow and one by one panel will move in reflow after gluing so that no extra movement will happened. image attached.
04-07-2022
13-07-2022
Quality
HOD okby : Rohit dwivedi
KPO: Okby :
CI: okby :
