Kaizen
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Facing warpage issue in smart phone
Previously we were facing warpage issue on printer top side after reflow bottom side pcb due to this facing dry solder , low volume & shorting issue on line.
Now we are using pallet fixture on bottom side and remove dowell pin from bottom pallet to reduce the pcb shrinkage issue so we get better result on printer and reduce smt failure also
01-03-2024
18-03-2024
Quality
HOD Okby : Ankur Sharma
KPO: OKby :
CI: okby :
