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Modification in stencil pad
Previously facing high failure in testing in Model Yuva3 MB. In this model the component R509 shifted one side after re-flow due to different pad design.
Now we modified the pad of R509 component and increase the paste amount in same component to avoid such shifting. now we are getting better result of it and no failure observed after the modification.
01-01-2024
20-01-2024
Quality
HOD OKby : Ankur Sharma
KPO: approvedby :
CI: okby :
