Kaizen
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proper placement of BGA component for high density mounting & avoid component hitting issue.
before use more radius nozzle tip for small BGA components.(240cn) Remark-this nozzle hit the other chip component during BGA placement.
now use small radius nozzle tip for small BGA component.(235cn) to avoid hitting issue.
11-12-2023
14-12-2023
Quality
HOD OKby : Ankur Sharma
KPO: approvedby :
CI: okby :
