Kaizen
Back
Defect handle in smart phone
Previously we were facing warpage issue on printer top side after reflow bottom side pcb due to this facing dry solder , low volume & shorting issue on line.
Now we are using pallet fixture on bottom side and remove dowell pin from bottom pallet to reduce the pcb shrinkage issue so we get better result on printer and reduce smt failure also
16-11-2023
04-12-2023
Quality
HOD Okby : Ankur Sharma
KPO: approvedby :
CI: okby :
