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Improvement for the Glue Spread at SIM Tray
In Blaze Pro Smart phone model at underfill machine stage gluing location assigned at wrong location due to this glue spread at sim tray because of less space.
Now we changed the location of glue to other side due to this improvement no issue observed of glue spread to sim card as gap is Enough. Now machine running ok without any issue.
01-11-2023
03-11-2023
Productivity
HOD Approvedby : Vipin Kumar
KPO: OKby :
CI: ok.by :
