Kaizen Star - Plant 1
Aakash Reddu
April - 2024
Total1
| Sr. No | Kaizen No | Kaizen Theme | Initiator | Team | Before Situation |
After Situation |
Month | ||
| 1 | LCIK - 42821 |
process improvement |
Jaydeep Chaturvedi , 51009711 |
"1. Handset PCBA Antenna Pin damage found at SFT stage of Assembly Line. 2. After Analysis found Receiver Antenna was damage, which found in 1st Clean room(PCBA Installation Satge). 3. Before PCBA Installation we mapped all stages Process in which 2 stages suspected found. > Small RF cable Locking stage,where after locking Operator Finger hitting or coming near by this antenna. > 2nd Stage was Copper foil Pasting where Operator handling was not ok,At this stage Operator when working in less CT as defined then before fixing in guide pillar PCBA Operator closing the Flap during this Misshandling PCBA antenna pin getting Damage. 4.Operator Neglegency during work on PCBA." | "1. Re-mapped the process of RF locking stage Operator that during bucking will take care finger will not come at this antenna.Also will ensure RF cable should be buckle in 1st time with proper alignment. 2 . All Stages Handling Process Checked,which all working on PCBA & Defect shown to all Operators. 3. Aware to Copper foil Pasting stage Operator that he will work after taking his Complete Cycle time,Flap will close after Fix PCBA in Guide pillar. 4. Also File the jig guide pillar daily shift starting for PCBA easily Fixing." | 07/2025 | |||
| 2 | LCIK - 37702 |
Process Improvement |
Akhilesh yadav , 51008584 |
Sanket , 51009008 , 51009929 |
All EOL model stencil and tolling was placed on shop floor and mixed up with running model so there was chances to load wrong tolling or stencil on line because of we have similar model name . | We make a list of EOL model and seperate all stencil and tolling and move to ground floor smt store. | 12/2022 | ||
| 3 | LCIK - 43337 |
Process Improvement |
Vikas kumar prajapati , 51009930 |
Shubham chand boudai , 51010132 Dibyendu Debnath , 51010734 |
We had added method for outer shield detection only hence it was difficult to judge for inner shield shift. | Now we have implemented the 3d height method for inner shield detection at Post AOI on base of PCB outing the shield, and validated the same and found feasible for inner shield shift detection. | 11/2025 | ||
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