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Kaizen Corner

Sr. No Kaizen No Kaizen Theme Initiator Team Before
Situation
After
Situation
Month
1 LCIK - 39306
Process improvement.
, 51009929
Sanket , 51009008
Brajesh , 51009217
we run small squeegee(150 mm) then excess solder at connector location and create shorting issue we used big length squeegee(250 mm) and change printer parameter according to big squeegee,same time update in parameter also. 11/2023
2 LCIK - 42639
process improvement.
SOMSHANKAR PATEL , 51009707
Rahul chand , 51008627
Earlier, in the cooling zone of the Reflow oven, we used a chiller-based cooling system to cool the PCB. This resulted in inconsistent temperature control and frequent moisture issues. Problem / Issue Identified: Uneven cooling was observed with the chiller system. Condensation formed on PCBs, affecting solder joints. Now, instead of the chiller, we use Nitrogen gas to cool the PCB. Nitrogen is a dry and inert gas, which: Prevents oxidation of solder joints Ensures controlled and uniform cooling Eliminates moisture-related defects 06/2025
3 LCIK - 40595
Process improvement.
, 51009680
RAJNEESH SEN , 45808
Before - :-Issue: Board getting stuck in the laser machine due to faulty sensors outside the conveyor. :-Consequence: Production delays, potential damage to boards, increased downtime. :-Process: Manual intervention required to clear the stuck boards, leading to inefficiency and increased labor costs. 05/2024
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