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Kaizen Corner

Sr. No Kaizen No Kaizen Theme Initiator Team Before
Situation
After
Situation
Month
1 LCIK - 40456
Process improvement.
, 51009929
Sanket , 51009008
WE ARE FACING MINOR BRIDGING BYPASS ISSUE AT BGA PAD IN KOHYOUNG SPI WE ARE CHANGE BGA ROI SEARCH 16MU TO 10MU TO LENTH SIDE PAD AND ALSO CHANGE THRESHOLD 40 MICRON TO 35 MICRON THAT WE IMPLEMENT SAME IN ALL SMART PHONE MODEL ALSO TESTING RESULT IS GOOD AFTER THAT IMPLEMENT. 05/2024
2 LCIK - 39949
Process improvement.
Shubham chand boudai , 51010132
, 51009929
Vikas kumar prajapati , 51009930
at 2d AOI some time no color luminance value difference between solder paste and component body color, due to this some time missing not detect. now we add OCI(optical color inspection) method with tight detection parameter (between 70~90%).this method also help for detection of wrong component. 03/2024
3 LCIK - 41741
Process improvement.
Shubham chand boudai , 51010132
Yashbir , 51008101
Vikas kumar prajapati , 51009930
In previous we use bight box method for detection . for some cases due to component and PCB color gray scale value approx. same so this is difficult to judge. Now we use universal method for detection . In this method edge locator set on the component edge in length side and in width side . when component billboard in PCB ,these edge locator shrink inside and value of shifting automatically decrease. 11/2024
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