Kaizen Star - Plant 1
Aakash Reddu
April - 2024
Total1
| Sr. No | Kaizen No | Kaizen Theme | Initiator | Team | Before Situation |
After Situation |
Month | ||
| 1 | LCIK - 42201 |
Quality improvement |
Krishna Kumar Singh , 51010395 |
Front camera dust issue observed due to distance between front camera assemble & PCBA fitment stage, In between dust particles are fixing on camera rubber. | Distance between front camera assemble and PCBA fitment stage have been decrease so now both stages almost nearby (only 2 stages which are doing work for only front camera). | 02/2025 | |||
| 2 | LCIK - 40666 |
Quality improvement |
ANKIT KUMAR , 166875 |
There was no any checkpoint defined of solder ball in back side, and As per normal visual inspection method it can’t be detected, because the solder ball was hide from LCD fpc. Defect visibility was getting detected by feel with finger or at a certain angle. | >> To prevent this issue one point added at Clean LCD solder pad SOP “To check the solder ball by finger feel after cleaning the solder pad”. >> For detection one more point added in insert battery SOP “Ensure after installing the battery with handset display should not glow or blink”. | 06/2024 | |||
| 3 | LCIK - 42970 |
Quality improvement |
Vishal , 51009466 |
Model_ Yuva Star 2 Sub PCBA was having headphone uplift issue. We observed that on one side of the pallet where headphone was sitting there was no space to fix the headphone due to which headphone was getting uplifted. | Modified other part of NG palette by palette router bit after that headphone uplift issue is not coming | 08/2025 | |||
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