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Kaizen Corner

Sr. No Kaizen No Kaizen Theme Initiator Team Before
Situation
After
Situation
Month
1 LCIK - 42200
Quality improvement
Sumit Kumar Maurya , 59428
P Sensor Dry soldering due less solder in the pad, paste at the pcba pad not getting melt properly and making contact with the part. Now we have increased 3 mils in both length & width of stencil aperture by this issue ahs been eliminated. 02/2025
2 LCIK - 37081
Quality Improvement
Man Singh , 51009389
ANKESH YADAV , 44320
ALOK KUMAR , 44422
10/2022
3 LCIK - 40665
Quality improvement
ANKIT KUMAR , 166875
There was no any process defined in SOP for fpc track visual and that’s why defect not intercept at assy it was identified at FT section as a function failure. 1. To Prevent this defect Checked LCD fpc process and raised the PCR for process modification. 2. One point added in SOP for track visual. “To check the LCD fpc track area after complete LCD soldering process it should not damage or cut also SSI checkpoint added on LCD and speaker soldering pad cleaning stage ”. 06/2024
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