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Kaizen Corner

Sr. No Kaizen No Kaizen Theme Initiator Team Before
Situation
After
Situation
Month
1 LCIK - 38736
REDUCE GLUE AMOUNT IN SMARTPHONE DUE TO HIGH SCRAP DURING REPAIR
Ashish Kr Singh , 55586
, 58862
Kartik Rautela , 55955
EARLIER WE HAVE DONE 0.030 mg TO 0.050mg glue due to this high amount during pcb repair bga pad off in smart phone now we have done 0.025 mg to 0.030 mg after that scrap rate during repair will be reduce . 06/2023
2 LCIK - 38297
REDUCE CIOMPONENT DAMAGE
Kartik Rautela , 55955
Rohit dwivedi , 51008107
Ashish Kr Singh , 55586
03/2023
3 LCIK - 37055
Reco scrap booking
Suresh chand , 51008894
, 59748
Before no Separate sheet to check the process and vender booking which mention in line reco sheet Now common sheet prepared to check reco Vender process in SAp as per Reco mention qty 10/2022
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